Umgangatho ophezulu we-china Umbala weNdalo we-G10 I-Epoxy glass fiber laminated sheet
Ingcaciso yeMveliso
G10 I-Epoxy glass fiber laminated sheet (Eqhelekileyo):Le mveliso yalanywa bubushushu obuphezulu kunye noxinzelelo oluphezulu ngelaphu le-fiber yeglasi efakwe kwi-epoxy resin.Ngeempawu eziphezulu zomatshini kunye ne-dielectric, ubushushu obuhle kunye nokumelana namaza, kunye nokusebenza kakuhle; Le mveliso inokuhlangabezana nomgangatho we-EU ROHS, ukuthunyelwa ngaphandle ngokubanzi kumzantsi-mpuma weAisa, eYurophu, eIndiya, njl.Okubaluleke ngakumbi le G10 laminate i-Halogen-free kunye ne-retardant yomlilo, ehambelana ne-eco-friendly kwaye inokwamkeleka kwiimarike zaseYurophu nezaseMelika.
I-G10 ayilogama eliphathekayo, kodwa ibakala lemathiriyeli, igama elithi G10 livela kwinkqubo yokuhlela ye-NEMA apho imigangatho ye-"G" ye "Glass fiber base"
Ukuthotyelwa kwemigangatho:
Ngokuhambelana ne-GB/T 1303.4-2009 yombane we-thermosetting resin industrial hard laminates iinkcukacha EPGC201.
Iimbonakalo
1.Iipropati zoomatshini eziphezulu;
2.Iimpawu zedielectric eziphezulu;
3.Ukumelana nokufuma okuhle;
4.Ukumelana nobushushu obuhle;
5.Ubuchule bokuchwetheza;
6.Ukumelana nobushushu:IBanga B
I-7.I-Halogen-free kunye ne-fire retardant
Isalathiso sokuSebenza esiPhambili
Ilungele ukusetyenziswa kwiimfuno zokufakelwa kwe-elektroniki ezisebenza kakhulu, ezifana nepleyiti yokuqinisa i-FPC, i-PCB yokugrumba, i-fiberglass meson, i-glass fiberboard i-potentiometer yefilimu yokuprinta ifilimu, iinkwenkwezi ezichanekileyo zokutyelela igiya (i-chip), ipleyiti yovavanyo oluchanekileyo, umbane (umbane) izixhobo zokugquma ukuhlala clapboard, ipleyiti yokugquma, ibhodi yokugquma isiguquli, iindawo zokugquma iimoto, ivili lokusila, ibhodi yokugquma i-Electronic switch, njl.
Isalathiso sokuSebenza esiPhambili
| HAYI. | INTO | IYUNITHI | ISALATHISI IXABISO | ||
| 1 | Ukuxinana | g/cm³ | 1.8-2.0 | ||
| 2 | Ireyithi yokufunxa amanzi | % | ≤0.5 | ||
| 3 | Amandla okugoba ngokuthe nkqo | MPa | ≥340 | ||
| 4 | Amandla oxinzelelo oluthe nkqo | MPa | ≥350 | ||
| 5 | Amandla empembelelo enxuseneyo (i-charpy type-gap) | KJ/m² | ≥37 | ||
| 6 | Amandla okucheba ahambelanayo | Mpa | ≥34 | ||
| 7 | Tensile strength | MPa | ≥300 | ||
| 8 | Amandla ombane amileyo (kwioyile ye90℃±2℃) | 1mm | KV/mm | ≥14.2 | |
| 2mm | ≥11.8 | ||||
| 3mm | ≥10.2 | ||||
| 9 | Umbane wokuqhekeka onxuseneyo (kwi-oyile ye-90 ℃ ± 2 ℃） | KV | ≥40 | ||
| 10 | I-Dielectric dissiption factor (50Hz) | - | ≤0.04 | ||
| 11 | I-Insulation Resistance | Okuqhelekileyo | Ω | ≥5.0×1012 | |
| Emva kokucwina iiyure ezingama-24 | ≥5.0×1010 | ||||
| 12 | Ukutsha (UL-94) | Inqanaba | V-0 | ||
