3241 Semiconductor Epoxy Glass ilaphu Laminated Sheet
Ingcaciso yeMveliso
Le mveliso yimveliso elaminethiweyo eyenziwe ngokucinezela okushushu nge-carbon black epoxy phenolic resin imregnation ye-alkali-free glass cloth enenjongo yombane. Ineempawu ze-semiconductor kwaye inokusetyenziswa njengento echasene ne-coroning phakathi kwee-motor grooves ezinkulu, kwaye inokusetyenziswa njenge-non-metallic wear-resisting structural parts phantsi kweemeko eziphezulu.
Iimbonakalo
Iipropati ze-1.Semiconductor;
Iipropati ze-2.Anticorona;
2.Iipropati ezilungileyo zoomatshini;
3.Ukumelana nokufuma;
4.Ukumelana nobushushu;
5.Ukumelana nobushushu:IBanga B
Ukuthotyelwa kweMigangatho
Ukubonakala: umphezulu kufuneka ube tyaba, ungabi namaqamza, imingxuma kunye nemibimbi, kodwa ezinye iziphene ezingachaphazeli ukusetyenziswa zivumelekile, ezifana nezi: imikrwelo, i-indentation, amabala kunye namabala ambalwa.
Isicelo
Inokusetyenziswa njengezinto ezichasene ne-anti-coroning phakathi kwegrooves enkulu yemoto, kwaye inokusetyenziswa njengezinto ezingeyiyo intsimbi yokunxiba ezichasene nezakhiwo phantsi kweemeko eziphezulu.
Isalathiso sokuSebenza esiPhambili
| HAYI. | INTO | IYUNITHI | ISALATHISI IXABISO | ||
| 1 | Ukuxinana | g/cm³ | 1.8-2.0 | ||
| 2 | Ireyithi yokufunxa amanzi | % | <0.5 | ||
| 3 | Amandla okugoba ngokuthe nkqo | MPa | ≥340 | ||
| 4 | Amandla oxinzelelo oluthe nkqo | MPa | ≥330 | ||
| 5 | Amandla empembelelo enxuseneyo (i-charpy type-gap) | KJ/m² | ≥30 | ||
| 6 | Tensile strength | MPa | ≥200 | ||
| 7 | I-Insulation Resistance | Ω | 1.0×103~1.0×106 | ||
