3241 Semiconductor Epoxy Glass ilaphu Laminated Sheet
Ingcaciso yeMveliso
Le mveliso yimveliso elaminethiweyo eyenziwe ngokucinezela okushushu ngekhabhoni emnyama epoxy phenolic resin impregnation yelaphu leglasi elinenjongo yombane elinealkali. Ineempawu zesemiconductor kwaye inokusetyenziswa njengezinto ezichasayo phakathi kwegrooves enkulu yemoto, kwaye inokuba nayo. isetyenziswe njengezinto ezingezizo zetsimbi ezichasene nezakhiwo phantsi kweemeko eziphezulu.
Iimbonakalo
Iipropati ze-1.Semiconductor;
Iipropati ze-2.Anticorona;
2.Iipropati ezilungileyo zoomatshini;
3.Ukumelana nokufuma;
4.Ukumelana nobushushu;
5.Ukumelana nobushushu:IBanga B
Ukuthotyelwa kweMigangatho
Imbonakalo: umphezulu kufuneka ube mcaba, ungabi namaqamza, imingxuma kunye nemibimbi, kodwa ezinye iziphene ezingachaphazeli ukusetyenziswa zivumelekile, ezinje: imikrwelo, ukufakwa, amabala kunye namabala ambalwa. ubuso besiphelo abuyi kunqanyulwa kwaye buqhekeke.
Isicelo
Inokusetyenziswa njengezinto ezichasene ne-anti-coroning phakathi kwegrooves enkulu yemoto, kwaye inokusetyenziswa njengezinto ezingeyiyo intsimbi yokunxiba ezichasene nezakhiwo phantsi kweemeko eziphezulu.
Isalathiso sokuSebenza esiPhambili
| HAYI. | INTO | IYUNITHI | ISALATHISI IXABISO | ||
| 1 | Ukuxinana | g/cm³ | 1.8-2.0 | ||
| 2 | Ireyithi yokufunxa amanzi | % | <0.5 | ||
| 3 | Amandla okugoba ngokuthe nkqo | MPa | ≥340 | ||
| 4 | Amandla oxinzelelo oluthe nkqo | MPa | ≥330 | ||
| 5 | Amandla empembelelo enxuseneyo (i-charpy type-gap) | KJ/m² | ≥30 | ||
| 6 | Tensile strength | MPa | ≥200 | ||
| 7 | I-Insulation Resistance | Ω | 1.0×103~1.0×106 | ||
